Gaya APA

Lau, J, H., Lee, S, R. (1999). Chip scale package : design, materials, process, reliability and applications . New York: The McGraw-Hill.

Gaya MLA

Lau, John, H.., Lee, Shi-Wei, Ricky. "Chip scale package : design, materials, process, reliability and applications". New York: The McGraw-Hill, 1999. Text.