Electronic Resource

Design of adhesive joints under humid conditions

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This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increase in numerical computing power there have been attempts to formalize the different environmental contributions in order to provide a procedure to predict assembly durability, based on an initial identification of diffusion coefficients and mechanical parameters for both the adhesive and the interface. A coupled numerical model for the joint of interest is then constructed and this allows local water content to be defined and resulting changes in adhesive and interface properties to be predicted.

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Ketersediaan

Informasi Detail

Judul Seri

Advanced Structured Materials

No. Panggil

E315

Penerbit

Berlin : Springer Berlin., 2013

Deskripsi Fisik

VII, 182 Hlm.

Bahasa

English

ISBN/ISSN

9783642375521

Klasifikasi

NONE

Tipe Isi

text

Tipe Media

computer

Tipe Pembawa

online resource

Edisi

1

Subjek

Surfaces and Interfaces
Solid mechanics
Thin films

Info Detail Spesifik

-

Pernyataan Tanggungjawab

Lucas F. M. Silva, Chiaki Sato

Versi lain/terkait

Lampiran Berkas

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