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Image of Reliability prediction from burn-in data fit to reliability models
Penanda Bagikan

Electronic Resource

Reliability prediction from burn-in data fit to reliability models

Bernstein, Joseph B. - Nama Orang;

This work will educate chip and system designers on a method for accurately predicting circuit and system reliability in order to estimate failures that will occur in the field as a function of operating conditions at the chip level. This book will combine the knowledge taught in many reliability publications and illustrate how to use the knowledge presented by the semiconductor manufacturing companies in combination with the HTOL end-of-life testing that is currently performed by the chip suppliers as part of their standard qualification procedure and make accurate reliability predictions. This book will allow chip designers to predict FIT and DPPM values as a function of operating conditions and chip temperature so that users ultimately will have control of reliability in their design so the reliability and performance will be considered concurrently with their design.

Key Features :
* The ability to include reliability calculations and test results in their product design
* The ability to use reliability data provided to them by their suppliers to make meaningful reliability predictions
* Have accurate failure rate calculations for calculating warrantee period replacement costs


Ketersediaan
#
Perpustakaan Pusat E1471
E1471
Tersedia
Informasi Detail
Judul Seri
-
No. Panggil
E1471
Penerbit
London : Academic Press., 2014
Deskripsi Fisik
x, 97 hlm.
Bahasa
English
ISBN/ISSN
9780128007471
Klasifikasi
NONE
Tipe Isi
text
Tipe Media
computer
Tipe Pembawa
online resource
Edisi
-
Subjek
Teknik Elektonika
Rancangan Sistem : Ilmu Komputer
Info Detail Spesifik
-
Pernyataan Tanggungjawab
Joseph B. Bernstein
Versi lain/terkait

Tidak tersedia versi lain

Lampiran Berkas
  • Reliability Prediction from Burn-In Data Fit to Reliability Models
    https://doi.org/10.1016/C2013-0-18752-1
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