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Ditemukan 149 dari pencarian Anda melalui kata kunci: subject="Perang"
Hal. Awal Sebelumnya 1 2 3 4 5 Berikutnya Hal. Akhir
cover
Open-source lab : how to build your own hardware and reduce research costs
Komentar Bagikan
Pearce, Joshua M.

Open-Source Lab: How to Build Your Own Hardware and Reduce Scientific Research Costs details the development of the free and open-source hardware revolution. The combination of open-source 3D printing and microcontrollers running on free software enables scientists, engineers, and lab personnel in every discipline to develop powerful research tools at unprecedented low costs. After reading O…

Edisi
-
ISBN/ISSN
9780124104624
Deskripsi Fisik
xvii, 271 hlm. : il. warna
Judul Seri
-
No. Panggil
E1391
cover
Small organic molecules on surfaces : fundamentals and applications
Komentar Bagikan
Sitter, HelmutDraxl, ClaudiaRamsey, Michael

This book deals with basic aspects of polymer electronics and optoelectronics. There is an enormous world-wide effort both in basic scientific research as well as in industrial development in the area of organic electronics. It is becoming increasingly clear that, if devices based on organic materials are ever going to have a significant relevance beyond being a cheap replacement for inorganic …

Edisi
-
ISBN/ISSN
9783642338489
Deskripsi Fisik
xv, 323 hlm.
Judul Seri
Springer Series in Materials Science (SSMATERIALS)
No. Panggil
E1737
cover
Pengembangan perangkat pembelajaran : silabus, RPP, PHB, bahan ajar
Komentar Bagikan
DaryantoDwicahyono, ArisPurwanto, Djanji

Bibliografi : hlm. 239-244

Edisi
-
ISBN/ISSN
9786027869295
Deskripsi Fisik
viii, 244 hlm. ; 23 cm.
Judul Seri
-
No. Panggil
371.33 DAR p
cover
App inventor: ciptakan sendiri aplikasi androidmu
Komentar Bagikan
Rini W., BenedictaMulyana, Eueung

Bibliografi : hlm. 189 No. Inv. : 146108-146109/P/Perp/15/2c

Edisi
-
ISBN/ISSN
9789792931686
Deskripsi Fisik
xviii, 190 hlm. : il. ; 23 cm.
Judul Seri
-
No. Panggil
005.38 MUL a
cover
Thermal deformation in machine tools
Komentar Bagikan
Ito, Yoshimi

Termasuk BibliografiNo Inv.: 139210, 139211/P/Perp/14/2c

Edisi
-
ISBN/ISSN
9780071635172
Deskripsi Fisik
xx, 214 hlm.
Judul Seri
-
No. Panggil
621.902 THE
cover
Software engineering best practices : lessons from successful projects in the…
Komentar Bagikan
Jones, Capers

Bibliografi : hlm. 643

Edisi
-
ISBN/ISSN
9780071621618
Deskripsi Fisik
xxvii, 660 hlm. ; 24 cm.
Judul Seri
-
No. Panggil
005.1 JON s
cover
Tools for teaching perangkat pembelajaran : teknik mempersiapkan dan melaksan…
Komentar Bagikan
Davis, Barbara GrossDianike, Elok

Termasuk Bibliografi No Inv.: 141100/Psm/Perp/14/1c

Edisi
Ed. 2
ISBN/ISSN
9789797695668
Deskripsi Fisik
xvii, 598 hlm.
Judul Seri
-
No. Panggil
371.33 DAV t
cover
Software engineering : a practitioner`s approach
Komentar Bagikan
Pressman, Roger S.Maxim, Bruce R.

Bibliografi : hlm. 909-932 No Inv.: 146927,146928/P/Perp/15/2c

Edisi
8th ed
ISBN/ISSN
9781259253157
Deskripsi Fisik
xxx, 941 hlm.
Judul Seri
-
No. Panggil
005.1 PRE s
cover
Ugly`s electrical safety and NFPA 70 E : for systems rafed at 600 volts and b…
Komentar Bagikan
Stauffer, H. Brooke

Bibliografi : hlm. 170-173 No Inv.: 146907/P/Perp/15/1c

Edisi
-
ISBN/ISSN
9780763768553
Deskripsi Fisik
vii, 173 hlm.
Judul Seri
-
No. Panggil
621.302 8 STA u
cover
A user's guide to electrical PPE
Komentar Bagikan
Jones, Ray A.Jones, Jane G.

Termasuk bibliografi No Inv.: 146908/P/Perp/15/1c

Edisi
-
ISBN/ISSN
9780763751142
Deskripsi Fisik
x, 156 hlm.
Judul Seri
-
No. Panggil
621.319 24 JON a
Hal. Awal Sebelumnya 1 2 3 4 5 Berikutnya Hal. Akhir